Study on Conductivity and Adhesion Properties of Epoxy/TPU conductive adhesive for Electronics Industry
碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === In this study, the resistance and physical properties of 40 wt% Ag electrically conductive adhesive (ECA) were investigated and improved. At first, different kinds of flake silver and spherical sliver were added in ECA at different weight ratio of flake sil...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u6cj8v |