The Study of the Enhancement for Bumping Dielectric Layer Process of Fan-out Wafer Level Package
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 107 === Fan-out wafer level packaging (FOWLP) has been developed gradually. However, the delamination is an unsolved problem. This study focused on the interfacial characteristics between Polyimide (PI) and Redistribution layer (RDL) for the FOWLP to decrease delam...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wq7ma9 |