HFSS Simulation for Predicting the Failure Factors in Plasma Treatment and Chip Delamination in Semiconductor Industry
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 107 === There are many processes in the semiconductor wire packaging process, including conductive adhesive dripping, die attaching, oven baking, plasma cleaning, die wire bonding and compound packaging. The semiconductor packaging factory found that under the same...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/xjc4aq |