Microstructure Analysis on the Lead-Frame Oxidation, Compound Delamination and the Process Optimization in Wire-bonding Packages
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 107 === This study proposed a novel pre-treatment process for copper lead-frame in the QFN(Quad Flat No-lead) packaging process which have been widely used in ASE Technology Holding Co., Ltd. Before copper lead-frame enter the packaging process, a pre-heat process...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/252v2b |