Applying Hybrid Design of Experiments and Assembly Approaches in IC Packaging Process
碩士 === 國立臺南大學 === 綠色能源學科技學系碩士在職專班 === 107 === Semiconductor and wafer assembly & testing process is one specialized division of high-tech-industry, and that is necessary to proceed high-precision wafer manufacturing under strict terms of cooperation with multi-process chain. The intense competit...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/9mmk5p |