Thermal Analysis and Comparison of IC Packaging
碩士 === 國立臺灣海洋大學 === 機械與機電工程學系 === 107 === Due to the need of saving space and IC cooling, SMT (Surface Mount Technology) has been widely used in mobile devices and consumer electronics. As IC technology, IOT industry and mobile communication keep developing, IC’s number of I/O and power consumption...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/e36q93 |