Effect of Sn Addition to Cu Substrate on the Interfacial Reaction with Lead Free Solder
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 107 === Fan-out wafer-level packaging (FOWLP) technology is gaining popularity for its performance and for its ability to meet high I/O counts. However, cracks were detected on Cu RDL under thermal stress. The material that can replace Cu must have better mechanical...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/zbv6b2 |