Design optimization and structural analysis of a 3D Abbe error-free wafer inspection stage

• Main Authors: Yen-Tso Kuo, 郭彥佐
• Other Authors: Tien-Tung Chung
• Format: Others
• Language: en_US
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/bqjn5j

碩士 === 國立臺灣大學 === 機械工程學研究所 === 107 === This thesis studies the detailed design, thermal analysis, and structural analysis of a self-built 3D Abbe-error free 12” wafer inspection stage. The structural components of the stage include base, gantry, X-stage, Y-stage, Z-stage, and vertical inspection probe stage. The measuring sub-systems includes an inspection probe system for multi-purpose measurement, an air bearing system for X-stage, and a laser interferometer system for measuring 3-axis motions. The overall design of Y-plate of the Y-stage has been modified for extra stiffness. The three reference mirror adaptors have been redesigned for inevitable thermal deformation and precise calibration requirement. The vertical inspection probe stage has an adjustable adaptor to control the pitch and yaw angle of Z-direction inspection probe. The two air bearings under X-plate have been modified for more mobility and stability. A platform beside gantry is designed to mount laser interferometer and optical components with good stability. All the stage components are assembled in AutoCAD and Inventor through customized parametric design programs. Then ANSYS and Inventor were used to analyze structural behaviors such as self-weight deformation, modal shapes, temperature distribution, and thermal deformation of the components. In addition, experiments using Laser Doppler vibrometer (LDV) and thermographic camera were performed to justify the results from structural analysis. Finally, prototype with these improved designs is manufactured and performances of the stage are measured. The results show that the overall performance of the wafer inspection stage is improved.