Application of novel color composite fringe projection profilometry technology for the flip-chip solder bump height measurement system
博士 === 國立臺灣科技大學 === 自動化及控制研究所 === 107 === This study developed a flip-chip solder bump height measurement system based on fringe projection profilometry technology. First, this study proposed a novel method of homography fringe generation, using the planar homography relationship between the coordin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72ae2f |