Coupling Design for Packaging III-V laser with SOI Photonic Chips using Semiconductor Micro-Mirrors
碩士 === 國立臺灣科技大學 === 電子工程系 === 107 === The integration of active and passive devices has been instrumental in achieving hybrid silicon laser as well as optical interconnects. In this thesis, the integration of active III-V laser and Silicon-On-Insulator Photonic Integrated Circuits through micro-mirr...
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| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/j45pya |