Numerical study of thermal uniformity and thermal stress analysis for the mold of IC packaging
碩士 === 國立臺灣科技大學 === 機械工程系 === 107 === In the modern era, the demand for the integrated circuit (IC) is rising continuously. In order to increase the number of packaged IC, the molds used for packaging are getting larger in size. The design of the heater has a significant effect on the thermal unifor...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e6pge4 |