Study on Smart Wafer for Process Parameter Measurement for Chemical Mechanical Polishing
碩士 === 國立臺灣科技大學 === 機械工程系 === 107 === In the semiconductor industry, variations in the downforce of wafers during chemical mechanical polishing / planarization, CMP polishing might cause some defects such as surface scratches, warpage, and corrosion. These defects can have a serious impact on the yi...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/58gsjn |