Interfacial Reactions in the Au-xAg/Al couples and Phase Equilibria of the Ag-Al-Au Ternary System
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 107 === Wire bonding technology in electronic assembly is the most widely used and mature connection circuit in recent years. Traditionally, it is used as a pure gold wire for wire bonding. In the process, a thin gold wire of 15-50 m is used for the wire bonding, an...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2tyq5w |