The Improvement of Bump Joint and Coplanarity of Fan-out Ball Grid Array Package
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 107 === With the development of the technologies of semiconductor manufacturing, high density chip package, in which, high I/O and fine-pitch/ ultra-fine pitch had been challenging the technology of advanced IC assembly. In various areas of applications,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7x8744 |