Studies on Peck-drilling Parameters and Cutting Characteristics in Mechanical Microdrilling of Ceramic Sheets
碩士 === 中國文化大學 === 機械工程學系數位機電碩士班 === 107 === Mechanical microdrilling process of a ceramic sheet is an important technique in semiconductor testing industry, which uses to fabricate the microhole array requiring in the probe head on a wafer probe card. Theses microholes are used to lead the microprob...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pu3499 |