Applying Smart Manufacturing in Core Processes of Microelectronic Packaging
碩士 === 國立臺北科技大學 === 管理學院資訊與財金管理EMBA專班 === 107 === An electronic company is used as a case study for its versatile products portfolio; this study is to deploy the infrastructure in smart manufacturing of the company. The roadmap is drawn for smart manufacturing project. The technologies of big data a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hvv439 |