Development of conductive copper ink/paste for flexible substrate

碩士 === 國立臺北科技大學 === 分子科學與工程系有機高分子碩士班 === 107 === In the first part of this study, an electrically conductive copper paste, witch can be sintered at a low temperature of 250°C, was successfully prepared. This paste was applied to make the busbar and finger portion on solar wafer. Conductive coppe...

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Bibliographic Details
Main Authors: LAI, CHING-WEN, 賴勁文
Other Authors: CHENG, YAO-YI
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/96x957