Study on the effect of adding BN composite filled powder on the thermal conductivity of PU
碩士 === 國立臺北科技大學 === 製造科技研究所 === 107 === With the three development trends of high performance, miniaturization and intensification of the electronics industry, heat dissipation has become one of the focuses of designing electronic products. Thermal interface materials (TIM) have often been used in r...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/b583a6 |