Using Six Sigma approach to improve the quality of SMT solder paste printing.

碩士 === 元智大學 === 工業工程與管理學系 === 107 === This study is based on five major steps of six Sigma (6σ)-DMAIC. Improve the quality of Surface Mount Technology (SMT) solder paste printing process, First find out the key quality characteristics, First find out the key quality characteristics, and use the Sold...

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Bibliographic Details
Main Authors: Chuan-Chia-Hsieh, 謝全家
Other Authors: Yun-Shiow Chen
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/pukyj3