Using Six Sigma approach to improve the quality of SMT solder paste printing.
碩士 === 元智大學 === 工業工程與管理學系 === 107 === This study is based on five major steps of six Sigma (6σ)-DMAIC. Improve the quality of Surface Mount Technology (SMT) solder paste printing process, First find out the key quality characteristics, First find out the key quality characteristics, and use the Sold...
Main Authors: | Chuan-Chia-Hsieh, 謝全家 |
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Other Authors: | Yun-Shiow Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2019
|
Online Access: | http://ndltd.ncl.edu.tw/handle/pukyj3 |
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