Lamination shrinkage prediction of printed circuit boards
碩士 === 元智大學 === 工業工程與管理學系 === 107 === The Multi-layer printed circuit board manufacturing lamination (PCB) process requires multiple to create produce line and size that meet the product of specifications. In the factory, the preset expansion value of negative film is currently set by the engineers...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/386ax6 |