Evaluation of Fine Cu Interconnects Deposited on the Glass Substrates
碩士 === 元智大學 === 化學工程與材料科學學系 === 107 === IC Carrier is the intermediate bridge for connecting IC and PCB, and can be further divided into BT, ABF and EMC. In the past, ABF carrier boards were mainly used in CPUs of computers and game consoles, as well as 3C communication products. In recent years, ne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7z5q65 |