Mechanisms of Blind-hole Cu Fillings and Self-annealing Behavior of Electroplating Cu
博士 === 元智大學 === 化學工程與材料科學學系 === 107 === Blind-hole (BH) metallization via Cu electrodeposition is a critical technology for printed circuit boards (PCBs) of high-density-interconnection (HDI) because it provides excellent thermal and electrical conductivity and efficient utilization of space. The as...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/c9wpd8 |