Optimization analysis of the influence on the non-uniformity of the wafer in chemical mechanical polishing process
碩士 === 元智大學 === 機械工程學系 === 107 === A two-dimensional axially symmetric model for Chemical-Mechanical Polishing (CMP) is established in this paper based on the SolidWorks Simulation. Whether the von Mises stress distribution on the wafer surface is consistent with the wafer surface Non-Uniformity dis...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98j6b6 |