The Evolution of the Void in Copper Bonding of 3DIC
碩士 === 國立交通大學 === 材料科學與工程學系所 === 108 === The technique of wafer bonding has changed. 2DIC was replaced by modern 3DIC. However, there are still some problems that need to be improved, especially the voids which is between bonded wafers. The voids may influence the electrical measurement, and the per...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8qp88y |