On Pre-Assignment Routing for Irregular Bumps on BGA Packages
碩士 === 國立交通大學 === 電子研究所 === 108 === With the advance of VLSI design technology, the demand of I/O pins is increasing. The flip-chip packaging technology which can provide high chip density is wildly used in modern package design. In modern flip-chip packages, the bumps often place irregularly due to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vb54g7 |