Low power techniques for global communication in CMOS VLSI

Technology trends and especially portable applications are adding a third dimension (power) to the previously two-dimensional (speed, area) VLSI design space. A large portion of power dissipation in high performance CMOS VLSI is due to the inherent difficulties in global communication at high rates...

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Bibliographic Details
Main Author: Stan, Mircea Raducu
Language:ENG
Published: ScholarWorks@UMass Amherst 1996
Subjects:
Online Access:https://scholarworks.umass.edu/dissertations/AAI9709658