Chemical fluid deposition: Reactive deposition of thin metal films from supercritical carbon dioxide solutions
The fabrication of microelectronics with increasing complexity and decreasing dimensions is placing stringent requirements on the deposition of metal films. These requirements include the conformal coverage of complex topographies, complete filling of narrow (<100 nm), high aspect ratio features,...
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| Language: | ENG |
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ScholarWorks@UMass Amherst
2001
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| Online Access: | https://scholarworks.umass.edu/dissertations/AAI3027180 |