Copper metallization in supercritical carbon dioxide: Applications and kinetics

Copper is the material of choice for advanced interconnects due to its low electrical resistance and superior electromigration resistance. However, as feature sizes are reduced in successive generations, the difficulty of filling high aspect ratio feature increases rapidly. Supercritical Fluid Depos...

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Bibliographic Details
Main Author: Zong, Yinfeng
Published: ScholarWorks@UMass Amherst 2005
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