Development of Through Glass Vias (TGVs) for Interposer Applications
In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). TGVs were fabricated by introducing nickel wires in via-holes that were pre-made on...
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| Format: | Others |
| Language: | English |
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KTH, Mikro- och nanosystemteknik
2014
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-165618 |