Evaluation of Chemical Mechanical Planarization Capability of Titan™ Wafer Carrier on Silicon Oxide
Chemical mechanical polishing (CMP) has emerged as a critical technique for the manufacture of complex integrated circuits to achieve low surface roughness and high degree of planarization. In particular, the continuous progression of the wafer carrier has been driven by the interest of diminishing...
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| Format: | Others |
| Language: | English |
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KTH, Skolan för informations- och kommunikationsteknik (ICT)
2017
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207088 |