Alternative electronic packaging concepts for high frequency electronics

Alternative electronic packaging concepts for high frequency electronics

The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize...

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Bibliographic Details
Main Author: Siebert, Wolfgang Peter
Format: Doctoral Thesis
Language:English
Published: KTH, Mikroelektronik och Informationsteknik, IMIT 2005
Subjects:
Electrical engineering
Connector
cooling
electronic
elastomer interconnect
EMC
shielded enclosure
high frequency
PCB
PWB
reverberation chamber
seams
soldering
twisted pair cable
Elektroteknik
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223

Internet

http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223

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