Alternative electronic packaging concepts for high frequency electronics

The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize...

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Bibliographic Details
Main Author: Siebert, Wolfgang Peter
Format: Doctoral Thesis
Language:English
Published: KTH, Mikroelektronik och Informationsteknik, IMIT 2005
Subjects:
EMC
PCB
PWB
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223