Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems
Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare...
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| Format: | Doctoral Thesis |
| Language: | English |
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KTH, Signaler, sensorer och system
2002
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3410 |