System-on-package solutions for multi-band RF front end
Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but a...
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| Format: | Doctoral Thesis |
| Language: | English |
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KTH, Mikroelektronik och Informationsteknik, IMIT
2005
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-482 http://nbn-resolving.de/urn:isbn:91-7178-187-0 |