Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates

Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O...

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Main Author: Törndahl, Tobias
Format: Doctoral Thesis
Language:English
Published: Uppsala universitet, Institutionen för materialkemi 2004
Subjects:
ALD
DFT
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651
http://nbn-resolving.de/urn:isbn:91-554-6081-X
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spelling ndltd-UPSALLA1-oai-DiVA.org-uu-46512013-01-08T13:04:03ZAtomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide SubstratesengTörndahl, TobiasUppsala universitet, Institutionen för materialkemiUppsala : Acta Universitatis Upsaliensis2004Inorganic chemistryAtomic Layer DepositionALDcoppercopper(I) oxidecopper(I) nitridedeposition pathwayCuClCu(hfac)2oxide substratesepitaxyDFTab-initioOorganisk kemiInorganic chemistryOorganisk kemiThin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates. Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water. For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results. Doctoral thesis, comprehensive summaryinfo:eu-repo/semantics/doctoralThesistexthttp://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651urn:isbn:91-554-6081-XComprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, 1104-232X ; 1035application/pdfinfo:eu-repo/semantics/openAccess
collection NDLTD
language English
format Doctoral Thesis
sources NDLTD
topic Inorganic chemistry
Atomic Layer Deposition
ALD
copper
copper(I) oxide
copper(I) nitride
deposition pathway
CuCl
Cu(hfac)2
oxide substrates
epitaxy
DFT
ab-initio
Oorganisk kemi
Inorganic chemistry
Oorganisk kemi
spellingShingle Inorganic chemistry
Atomic Layer Deposition
ALD
copper
copper(I) oxide
copper(I) nitride
deposition pathway
CuCl
Cu(hfac)2
oxide substrates
epitaxy
DFT
ab-initio
Oorganisk kemi
Inorganic chemistry
Oorganisk kemi
Törndahl, Tobias
Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
description Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates. Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water. For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results.
author Törndahl, Tobias
author_facet Törndahl, Tobias
author_sort Törndahl, Tobias
title Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
title_short Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
title_full Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
title_fullStr Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
title_full_unstemmed Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
title_sort atomic layer deposition of copper, copper(i) oxide and copper(i) nitride on oxide substrates
publisher Uppsala universitet, Institutionen för materialkemi
publishDate 2004
url http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651
http://nbn-resolving.de/urn:isbn:91-554-6081-X
work_keys_str_mv AT torndahltobias atomiclayerdepositionofcoppercopperioxideandcopperinitrideonoxidesubstrates
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