Ultrasound Hardware Setup For CMP Pad Characterization
Chemical Mechanical Polishing, (CMP), pads made of polyurethane material are utilized in the Integrated Circuit, (IC), industry to planarize wafers between successive process steps. The properties of such pads and their behavior must be known in order to determine under what conditions and for how l...
| Main Author: | |
|---|---|
| Format: | Others |
| Published: |
Scholar Commons
2004
|
| Subjects: | |
| Online Access: | https://scholarcommons.usf.edu/etd/1264 https://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=2263&context=etd |