An Investigation of BGA Electronic Packaging Moiré Interferometry
As technology progresses towards smaller electronic packages, thermo-mechanical considerations pose a challenge to package designers. One area of difficulty is the ability to predict the fatigue life of the solder connections. To do this one must be able to accurately model the thermo-mechanical per...
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| Format: | Others |
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Scholar Commons
2003
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| Online Access: | https://scholarcommons.usf.edu/etd/1459 https://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=2458&context=etd |