Chemical Mechanical Planarization of Electronic Materials
In the modern semiconductor manufacturing processes, chemical mechanical planarization (CMP) has attained important processing step because of its ability to provide global planarization. CMP is the planarization technique which is used for the removal of excess material, as left over from the previ...
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Scholar Commons
2012
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Online Access: | http://scholarcommons.usf.edu/etd/4280 http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=5476&context=etd |