Chemical Mechanical Planarization of Electronic Materials

In the modern semiconductor manufacturing processes, chemical mechanical planarization (CMP) has attained important processing step because of its ability to provide global planarization. CMP is the planarization technique which is used for the removal of excess material, as left over from the previ...

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Bibliographic Details
Main Author: Atiquzzaman, Fnu
Format: Others
Published: Scholar Commons 2012
Subjects:
CVD
Online Access:http://scholarcommons.usf.edu/etd/4280
http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=5476&context=etd