Electroplating on 3D Printed Conductive Track
There are substantial advances in Additive Manufacturing (AM) technologies. The simplest and advantageous technique of AM in terms of cost and scaling of the substrate is Fused Deposition Modeling(FDM). Currently, integration of electronics to a 3D printed structure is done manually after f...
Main Author: | |
---|---|
Format: | Others |
Published: |
Scholar Commons
2017
|
Subjects: | |
Online Access: | https://scholarcommons.usf.edu/etd/7412 https://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=8609&context=etd |