Experimental study of void formation in solder joints of flip-chip assemblies

Experimental study of void formation in solder joints of flip-chip assemblies

Not available === text

Bibliographic Details
Main Author: Wang, Daijiao, 1970-
Format: Others
Language:English
Published: 2008
Subjects:
Welded joints
Solder and soldering
Multichip modules (Microelectronics)
Online Access:http://hdl.handle.net/2152/1754

Internet

http://hdl.handle.net/2152/1754

Similar Items