Wang, D. (2008). Experimental study of void formation in solder joints of flip-chip assemblies.
Chicago Style (17th ed.) CitationWang, Daijiao. Experimental Study of Void Formation in Solder Joints of Flip-chip Assemblies. 2008.
MLA (8th ed.) CitationWang, Daijiao. Experimental Study of Void Formation in Solder Joints of Flip-chip Assemblies. 2008.
Warning: These citations may not always be 100% accurate.