Experimental study of void formation in solder joints of flip-chip assemblies

Experimental study of void formation in solder joints of flip-chip assemblies

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Bibliographic Details
Main Author:	Wang, Daijiao, 1970-
Format:	Others
Language:	English
Published:	2008
Subjects:	Welded joints Solder and soldering Multichip modules (Microelectronics)
Online Access:	http://hdl.handle.net/2152/1754

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