Formation of ultra-thin Ta-based Cu diffusion barrier with atomic layer deposition

Formation of ultra-thin Ta-based Cu diffusion barrier with atomic layer deposition

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Bibliographic Details
Main Author:	Lui, Junjun
Format:	Others
Language:	English
Published:	2008
Subjects:	Dielectrics > Surfaces
Online Access:	http://hdl.handle.net/2152/2573

Internet

http://hdl.handle.net/2152/2573