Investigation of electromigration reliability of solder joint in flip-chip packages
Electromigration related damage in solder bumps is one of the emerging issues resulting from the fast scaling-down of features in semiconductor packages. Although the electromigration phenomenon has been intensively studied on silicon level interconnect lines since the late 1960s, it is far less und...
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| Format: | Others |
| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/2152/3205 |