Analysis of electromigration in single- and dual-inlaid Cu interconnects

Analysis of electromigration in single- and dual-inlaid Cu interconnects

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Bibliographic Details
Main Author:	Justison, Patrick Ryan
Format:	Others
Language:	English
Published:	2008
Subjects:	Electrodiffusion Copper > Industrial applications
Online Access:	http://hdl.handle.net/2152/685

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