Electromigration and chip-package interaction reliability of flip chip packages with Cu pillar bumps
The electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages with Cu pillar structures was investigated. First the EM-related characteristics of Cu pillars with solder tips were studied and compared with standard controlled collapse chip connection (C4) Pb-free sold...
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| Format: | Others |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/2152/ETD-UT-2011-12-4474 |