Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules

This thesis investigates techniques for prototyping and evaluation of medium voltage (MV) power module packages. Specific focus will be given to the utilization of silver sintering as a bonding method for high temperature, high density power modules. Nano-silver paste and preform will be examined i...

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Bibliographic Details
Main Author: Gersh, Jacob Daniel
Other Authors: Electrical Engineering
Format: Others
Published: Virginia Tech 2021
Subjects:
Online Access:http://hdl.handle.net/10919/103894