3D Commutation-Loop Design Methodology for a SiC Based Matrix Converter run in Step-up mode with PCB Aluminum Nitride Cooling Inlay

3D Commutation-Loop Design Methodology for a SiC Based Matrix Converter run in Step-up mode with PCB Aluminum Nitride Cooling Inlay

This work investigates three-dimensional power loop layout for application to a SiC based matrix converter, providing a symmetric, low-inductance solution. The thesis presents various layout types to achieve this design target, and details the implementation of a hybrid layout to the matrix converte...

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Bibliographic Details
Main Author: Baker, Victoria Isabelle
Other Authors: Electrical Engineering
Format: Others
Published: Virginia Tech 2021
Subjects:
matrix converter
silicon carbide
surface mount device
power loop design
low inductance
Online Access:http://hdl.handle.net/10919/104361

Internet

http://hdl.handle.net/10919/104361

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