Packaging of a High Power Density Point of Load Converter
Due to the power requirements for today\'s microprocessors, point of load converter packaging is becoming an important issue. Traditional thermal management techniques involved in removing heat from a printed circuit board are being tested as today\'s technologies require small footprint...
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| Format: | Others |
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Virginia Tech
2013
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| Online Access: | http://hdl.handle.net/10919/19325 |