Electrical Integration of SiC Power Devices for High-Power-Density Applications

Electrical Integration of SiC Power Devices for High-Power-Density Applications

The trend of electrification in transportation applications has led to the fast development of high-power-density power electronics converters. High-switching-frequency and high-temperature operations are the two key factors towards this target. Both requirements, however, are challenging the fundam...

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Bibliographic Details
Main Author: Chen, Zheng
Other Authors: Electrical and Computer Engineering
Format: Others
Published: Virginia Tech 2013
Subjects:
High power density
high temperature
high frequency
silicon carbide
device characterization
gate oxide stability
stray inductance
wire-bond packaging
hybrid packaging
switching loop snubber
Online Access:http://hdl.handle.net/10919/23923

Internet

http://hdl.handle.net/10919/23923

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